Modified Polyamide hot melt adhesive series are polyamide hot melt adhesive resin modified by Polycondensation. It has good heat/cold/oil resistance, it is odorless, flexibile, fast curing and etc. It has good adhesion with metal or nonmetal material and has been widely used in electronics, shoe, automobile filter, heat-shrink tube and so on. It is a new type of high performance polyamide hot melt adhesive.
Technical Data
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Series
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Type
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Form
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Melting Range DSC (℃)
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Melting Flow Index g/10 min, 160℃
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Press Condition
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Time (S)
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Temp (℃)
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Press (kgf/㎡)
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| PA Material | 2080 | P,G | 80-90 | 45-75 | 15 | 100 | 2 |
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Series
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Type
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Form
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Melting Range DSC (℃)
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Viscosity (210℃ Pa.S)
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| PA Material | 2120 | G | 110-125 | 3000-5000 |
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Series
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Type
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Form
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Softening Point (℃)
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Viscosity (210℃ Pa.S)
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| PA Material | 2170 | G | 145-155 | 3000-7000 |
| 2171 | G | 155-165 | 3000-7000 | |
| 2173 | G | 185 | 3000-7000 | |
| 2175 | G | 195 | 2000-8000 | |
| 2120 | G | 110 | 3000-5000 |
Remark
1.Product technical data is based on typical product, it does not represent our guarantee to this product. Please consult us for specific product data.
2.Specification: 0-80um is used for starch producing of heat transfer, flocking and gliding. 0-120, 0-160, 0-170um for powder dot process. 80-170 and 80-200um for double dot process for interlining. 5-200, 150-250 and 180-420um for powder scattering process. We can make different particle size for customized requirements.
3.Form: P: powder G: granule
